Ceramic Cavity Package

Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom.

Ceramic cavity package. The traditional package for rf power transistors is the air cavity package with a ceramic lid. Air cavity type hermetic package close thermal expansion matching provides superior mechanical elasticity and less mechanical stress with silicon mems chips miniaturized high density surface mountable package incorporating multi layer ceramic technology. Cupack packages unique design with very low thermal resistance. Hermetic or vacuum sealing is typically applied to ensure device quality.

The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum. If saving time and reducing cost is important for your ceramic air cavity packages talk to one of our experts about the fully assembled ca pack package solution. Packages are available in surface mount designs as well as bolt down versions in dozens of open tooled designs. Ceramic air cavity packages proven performance for wireless applications.

Available in larger sizes up to a cavity of 16 5 mm x 6 1 mm ni780 header unmetallized frames enable shorter lead times and reduce manufacturing complexity.