Ceramic Chip Carrier

Commercial quasi hermetic smt package.

Ceramic chip carrier. Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no. Tapepak plug family coinstack magazine. Fully hermetic smt package. 18 small outline transistor family.

Tapepak magazine family metal coinstack co 019. Other forms are proprietary. Leadless chip carriers are ideal for surface mount applications. 17 84 lead ceramic leaded cl chip carrier with window square cerquad.

Ceramic chip carrier. Chip carriers can be smaller than dual in line packages and since they use all four edges of the package they can have a larger pin count. Socket or surface mount package. Solder glass or epoxy seal.

The external lead frame is formed into a j shape to allow for socketing or direct board soldering. In high heat dissipation applications this proves to be an ideal package. Carrier outlines co family registration no. Plastic magazine plug family co 022.

Gold or solder dip. Chip carriers may be made of ceramic or plastic. Package outline material information. Plastic magazine family coinstack co 021.

Castellations instead external leads. Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below. I updated 10 05 ceramic chip carrier magazine type a b and d 68 pin leadless co 006. Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications.

The leadless chip carrier s low profile multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and bottom of the package. 1st 2nd 3rd total seal ring die attach a x b c x d e x. Variety of body sizes. Ceramic chip carrier cerquad family 68 lead ceramic leaded cl chip carrier with window square cerquad.

Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications. Low profile multilayer ceramic package. Footprint compatible with cqjb and plcc. Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or.

Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount. Clcc ceramic leadless chip carrier mm inch unit.