Ceramic Hybrid Ic Packaging

Transistors diodes or monolithic ics and passive components e g.

Ceramic hybrid ic packaging. Twenty mil thick ultra. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Mechanical integrity provided by using shoulder pins. 0 100 double row edge pinout.

Plated holes enabling multiple conductor levels. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the pcb. A multi chip module mcm is generically an electronic assembly such as a package with a number of conductor terminals or pins where multiple integrated circuits ics or chips semiconductor dies and or other discrete components are integrated usually onto a unifying substrate so that in use it can be treated as if it were a larger ic. Other terms such as hybrid or hybrid.

In support of our defense customers we are an itar registered facility accredited trusted supplier and dla mil prf 38535 certified assembly mfg. 0 010 pad spacing matches ic sensor. Circular and slotted holes allow mechanical positioning. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

At the same time the vacuum tight housings and substrates must. Resistors inductors transformers and capacitors bonded to a substrate or printed circuit board pcb. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. Co 2 lasered ceramic with matching window frame.

Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.