Ceramic Leadless Chip Carrier Socket

Surface mount and soldertail options are available.

Ceramic leadless chip carrier socket. A premolded plcc was originally released in 1976 but did not see much market adoption. A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing. Gold or solder dip. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc.

28 44 52 68 84 and 124. Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications. 28 44 52 68 84 and 124. Generally speaking sockets for plcc chips j lead are not compatible with leadless chip carriers since their contacts are typically recessed between fingers that align and grip the plcc package itself.

Heat sinks also available in six sizes. Footprint compatible with cqjb and plcc. Castellations instead external leads. The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in.

Leadless chip carrier sockets conform to jedec standards a b c and d. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Heat sinks also available in six sizes. Leadless chip carrier sockets conform to jedec standards a b c and d.

A plastic leaded chip carrier plcc has a rectangular plastic housing it is a reduced cost evolution of the ceramic leadless chip carrier clcc. Low profile multilayer ceramic package. Surface mount and soldertail options are available. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.

Variety of body sizes. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Socket or surface mount package.

Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action. Solder glass or epoxy seal. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact. The chip is held into the socket by friction.