Ceramic Leadless Package

Leadless smt ceramic packages and substrates feature consistent dielectric properties enhanced thermal management and improved reliability.

Ceramic leadless package. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering though sockets can be used for testing. Lcc packages have pads on all four sides of the package. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Leaded chip carriers have metal leads wrapped around the edge of the package in the shape of a letter j.

Leadless chip carriers have metal pads on the edges. Commercial quasi hermetic smt package. Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount. The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads.

Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. Fully hermetic smt package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.

Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or. Leadless ceramic carrier this surface mount package consists of a ceramic base that has metalized castellations pads on the sides and bottom of the package. Ns package number e84a 84 lead ceramic leadless chip carrier type b ns package number e84b life support policy national s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president and general. Lcc ceramic leadless chip carrier for silicon and mems.

For electrical connection to the outside world the lcc instead uses flat metal contacts or metallized castellations known as pads around the four sides of the package bottom.